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A new technical paper titled “Aging Aware Steepening of the Fault Coverage Curve of a Scan Based Transition Fault Test Set” was published by researchers at Purdue University. Abstract “Chip aging may result in hardware defects whose likelihood of occurrence depends on the layout and functional workload at the defect site. In-field testing is important... » read more
The post Aging Aware Steepening Metric for the Fault Coverage of a Test Set (Purdue Univ.) appeared first on Semiconductor Engineering.